Advanced Materials

Tuesday, 26 March 2019
02:30 pm - 03:30 pm


Learn about the particular importance of the advanced materials for Electronics-Based Systems
Advanced materials have special importance for Microelectronics, as of late striving to meet the needs for ultimate miniaturization.  In this session, TDK introduces CeraPad's ultra-thin substrate with integrated ESD protection, which enables designers to develop more compact and cost-efficient LED solutions combined with higher pixel counts.  Furthermore, what are the enabling factors for the digitalization of materials, processes, and products including subsystems and devices? Find these answers in this specific smart production session dedicated to the advanced materials and materials science
Chair: Elke Kraker, Microelectronics/ Reliability and Analytics for 3D Integration and Packaging,  Materials Center Leoben Forschung GmbH (MCL)
  • Chen How Cheah, TDK Electronics, “CeraPad-Advanced ceramic substrate solution for future LED applications”
  • Günther Maier, Materials Competence Center (MCL) Leoben: "Digital Materials in Analogue World"
  • Marko Omazic, Gernot Oreski (PCCL), and Michael Pinczolits (Infineon Technologies Austria) “Monitoring of UV Irradiation Efficiency in Semiconductor Pre-assembly Manufacturing”


Chen How Cheah

Project manager CeraPad™ TDK Electronics Gmbh & Co OG, Piezo & Protection Devices Business Group Deutschlandsberg, Austria

Günther A. Maier

Head Materials for Microelectronics, Materials Center Leoben Forschung GmbH

Gernot Oreski 

Division Manager at the Polymer Competence Center Leoben (Austria), Head of the  »Smart Material and Surface Testing« division

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